Semiconductor Bonding: Enabling Advanced Chip Fabrication Semiconductor bonding is a crucial process in the manufacturing of microelectronic devices, enabling the interconnection of various components such as wafers, dies, and substrates. This process plays a vital role in 3D integration, heterogeneous packaging, MEMS, and advanced IC fabrication. As device architectures become more compact and...

Introduction Semiconductor bonding is a crucial step in the manufacturing of integrated circuits (ICs), enabling the precise connection of microelectronic components. As electronic devices become more compact, powerful, and multifunctional, the importance of accurate and reliable bonding techniques increases. The semiconductor bonding market is evolving alongside trends in miniaturization, 3D...